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Partnerships & Collaborations North America · 25 September 2026

ACL Digital Announces TSMC OIP Partner of the Year Designation for 2026 in the US

RD

Research Desk

25 September 2026 · 2 min read

Design and engineering services firm ACL Digital has been recognised with the 2026 TSMC Open Innovation Platform (OIP) Partner of the Year Award for Design Service Excellence.

The award was announced at the TSMC 2026 North America OIP Ecosystem Forum and recognises ACL Digital's contributions in providing advanced design services for mutual customers across AI, data center, and IoT markets.

Recognition for Design Service Excellence

ACL Digital, part of the ALTEN Group, received the award for its work within TSMC's design ecosystem and its support for customers developing next-generation semiconductor solutions.

TSMC's Open Innovation Platform brings together customers and ecosystem partners across the semiconductor design chain, including companies providing design services, intellectual property, electronic design automation, and related technologies.

ACL Digital said the recognition reflects its ongoing collaboration with TSMC and its alignment with the foundry's technology roadmap.

Supporting AI and Data Center Applications

A key focus of ACL Digital's work with TSMC is the development of semiconductor solutions for AI and data center systems.

The company provides optimized silicon design and system architecture intended to support intensive AI workloads and enterprise computing requirements.

ACL Digital also works on semiconductor solutions for IoT and edge-computing applications, with an emphasis on low-power and high-efficiency designs.

The company said the partnership with TSMC has helped mutual customers develop next-generation chips for data center, AI, and IoT markets.

Expanding Advanced Semiconductor Design Capabilities

ACL Digital has also been strengthening its capabilities through advanced-node design training made available through the TSMC OIP ecosystem.

The company said these initiatives have helped expand its technical expertise and improve its ability to support customers working on increasingly complex semiconductor designs.

Prasanna Shroff, Head of Semiconductor at ACL Digital, said the collaboration has enabled customers to scale next-generation chip designs more efficiently across key application areas.

Long-Term Collaboration With TSMC

Ramandeep Singh, CEO of ACL Digital, said the award reflects the companies' shared focus on helping customers address complex engineering challenges and bring advanced technology concepts closer to market.

ACL Digital said it intends to continue aligning its technology roadmap with TSMC's process and platform developments as demand for higher-performance silicon grows across AI and enterprise computing markets.

Strengthening Its Role in the Semiconductor Ecosystem

ACL Digital operates across the technology stack from chip design to cloud-based systems and positions semiconductor engineering as a core part of its wider digital and systems engineering business.

Recognition within TSMC's OIP ecosystem strengthens the company's position as a design services partner supporting customers developing silicon for advanced computing applications.

The company plans to expand its footprint within the OIP ecosystem and further strengthen its capabilities in AI, data center, IoT, and other semiconductor application areas.

Category

Partnerships & Collaborations

Region

North America

Industry

Semiconductor

Published

25 September 2026

Length

2 min read

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