Element Six and Entegris Launch Collaboration to Integrate Synthetic Diamond Cooling into GPU and RF Packaging

Element Six and Entegris, Inc. have formed a strategic collaboration, announced on November 3, 2026, from Santa Clara, California, to bring synthetic diamond-enabled thermal management into advanced packaging for graphics processing unit (GPU) and radio frequency (RF) devices.

Element Six is a world leader in synthetic diamond industrial solutions, while Entegris is a leading supplier of advanced materials and surface engineering for the semiconductor industry.

Synthetic diamond integration targets advanced semiconductor devices

The devices targeted by the partnership underpin high-performance computing (HPC), data centers, and high-speed wireless communications, serving applications across artificial intelligence (AI), telecommunications, and defense.

Under the agreement, Element Six's engineered synthetic diamond materials expertise will be combined with Entegris' semiconductor materials science and surface engineering leadership to develop scalable solutions for incorporating synthetic diamond into advanced semiconductor packages and devices.

Power density pushes conventional cooling toward its limits

The announcement describes thermal management as an increasingly critical determinant of semiconductor performance, efficiency, and scalability as AI-driven growth in chip power density accelerates.

Semiconductor manufacturers and hyperscalers, according to the companies, are seeking solutions that deliver greater compute performance while cutting energy consumption and system complexity.

As conventional cooling technologies approach practical limits, advanced materials such as synthetic diamond and its composites are expected to take on a growing role in enabling the next generation of GPU and RF devices. Synthetic diamond has the highest thermal conductivity of any material at room temperature, which makes it a promising candidate for advanced thermal management.

The companies cautioned, however, that realizing this potential depends on innovative methods for bonding diamond to semiconductor wafers and dies for advanced packaging integration while keeping thermal boundary resistance at the interface to a minimum.

A portfolio spanning engineered surfaces and bonded diamond

Through the collaboration, the two firms intend to offer semiconductor manufacturers a broad portfolio of diamond-enabled solutions.

These include engineered surfaces built to challenging, customized specifications, alongside bonded diamond technologies covering both polycrystalline and single-crystal diamond platforms.

The companies stated that this flexibility allows customers to choose the approach best matched to their device architectures, packaging strategies, and performance requirements, which reduces integration complexity and speeds deployment.

A particular focus, they said, is on scalable, cost-effective wafer-level and heterogeneous integration approaches that can cut manufacturing complexity, minimize thermal boundary resistance, and meet the performance demands of next-generation GPU and RF devices.

What the executives said

Siobhán Duffy, CEO at Element Six, said that combining E6's synthetic diamond materials expertise with Entegris' surface engineering capabilities offers the semiconductor community a new tool box of synthetic diamond-based thermal management solutions, enabling new levels of performance and efficiency.

She observed that the semiconductor industry is actively looking for new ways to address thermal constraints as advanced semiconductor architectures continue to push device performance to new levels.

Olivier Blachier, Chief Innovation Officer and President of Materials Solutions at Entegris, framed the opportunity as more than introducing a material with promising thermal properties. The real task, he said, is engineering the surfaces and bonding approaches that make synthetic diamond suitable for advanced packaging.

Working with Element Six, he added, Entegris is tackling an emerging industry challenge by developing a range of approaches, from engineered surfaces to bonded synthetic diamond technologies, to support the differing requirements of next-generation GPU and RF devices.

Scaling up adoption across semiconductor needs

According to the joint announcement, the partnership is intended to accelerate the adoption of synthetic diamond across both existing and emerging semiconductor needs by enabling scalable manufacturing approaches and reducing integration complexity.

Background on the two companies

Element Six, part of the De Beers Group, designs, develops, and produces synthetic diamond advanced material solutions and has done so for over eighty years, harnessing the extreme properties of synthetic diamond in fields including photonics, acoustics, power transmission, water treatment, thermal management, and sensors.

The company operates worldwide, with primary manufacturing facilities in the US, UK, Ireland, Germany, and South Africa. Its solutions serve multiple industries, from automotive and consumer electronics manufacturing to cutting and drilling in oil and gas and components for mining, road, construction, and agriculture applications.

Entegris is a leading supplier of advanced materials and surface engineering for the semiconductor industry.