Renesas Shrinks Its GreenPAK Line to 1.155mm With New Configurable Mixed-Signal Device

Renesas Electronics Corporation has added a device to its GreenPAK portfolio that it claims occupies less board space than any other product in the family, targeting the growing segment of consumer electronics where millimeters matter.

The SLG46801, announced on September 24, 2026, arrives in a 9-ball wafer-level chip-scale package measuring just 1.155mm × 1.155mm, a footprint Renesas describes as the smallest WLCSP-packaged GreenPAK IC in the industry.

Two Package Formats Serve Different Design Priorities

Beyond the flagship WLCSP, the SLG46801 is also offered in a 12-lead STQFN package measuring 1.6mm × 1.6mm × 0.55mm. Renesas says the STQFN format delivers more GPIO pins than the WLCSP and is aimed at designs where an industrial package standard is preferred. T

The company presents the two options as a deliberate tradeoff between achieving the minimum possible board footprint with the WLCSP and gaining additional pin accessibility through the STQFN. Renesas also characterizes the SLG46801 as offering one of the lowest costs per GPIO within the broader GreenPAK product line.

What the Device Integrates

The SLG46801 brings together two high-speed analog comparators, configurable lookup tables, counters and delays, 10kHz and 25MHz oscillators, voltage-tolerant GPIOs, and an I²C-compatible serial interface. Renesas positions this mix of analog, logic, and timing functions as enabling designers to either complement a microcontroller or replace several discrete components with a single compact part. The device operates and can be programmed across a supply voltage range of 1.71V to 5.5V.

Renesas describes this as the widest operating and configurable range among its multi-time programmable GreenPAK devices. GPIO pins on the SLG46801 can be dynamically reassigned to function as the I²C interface, a capability Renesas says is particularly useful in systems where pin count is tightly constrained. The device also supports optional CRC-8 and read-back protection for more controlled configuration deployments.

Field Reconfiguration Through I²C

The SLG46801 uses multi-time programmable non-volatile memory, meaning its configuration can be updated after the device is already embedded in a finished product. Engineers can push bug fixes, configuration changes, or product updates through the device's I²C interface without requiring a hardware redesign or a new board revision. A target I²C enable function works alongside the multi-time programmability to make post-shipment updates possible, a feature Renesas explicitly highlights as a mechanism for reducing redesign cycles once products have reached end users.

Jason Kim, Vice President and General Manager of the Core Analog Division at Renesas, described the business problem the device is meant to address. "Designers are being asked to integrate more functionality into increasingly compact products without increasing system cost or development effort, while also reducing power consumption," Kim said. "The SLG46801 expands our GreenPAK portfolio with an ultra-compact WLCSP option and flexible in-system configurability, helping customers create smaller, more feature-rich products and implement updates even after deployment."

Application Segments and Market Context

Renesas lists smart rings, smartwatches, fitness bands, VR glasses, and portable electronics as primary targets for the SLG46801, all product categories in which board space and component count are identified as critical design constraints.

The company also cites a wider range of applicable segments, including smart-home systems, networking and communications, computing and storage, industrial control, and IoT sensor nodes. Sensing, control, glue-logic, timing, and system housekeeping are the specific functional roles Renesas associates with the device across those categories.

The announcement frames the SLG46801 as a direct response to an industry pattern in which manufacturers are expected to deliver richer feature sets within tighter physical and cost boundaries, consolidating commonly used mixed-signal functions into a single low-power component.

Development Tooling

Renesas supports design work on the SLG46801 through its Go Configure Software Hub, a free graphical user interface-based development environment. The company says the tool allows customers to build custom hardware functions without needing additional discrete components or writing complex firmware. Programming, emulation, and simulation capabilities for the SLG46801 are all available within the software hub.

Availability and Company Background

The STQFN package version of the SLG46801 was available for sampling as of the September 24, 2026 announcement date. Mass production availability for the WLCSP package variant is scheduled for November 2026. Renesas states it has shipped more than four billion GreenPAK devices worldwide and describes itself as a leader in configurable mixed-signal technology.